Smart Card Module Packaging and Testing
Establish a comprehensive production management and quality control system, with the manufacturing technology for contact (dual-interface) modules and contactless modules at the forefront nationally. Designated by the Ministry of Information Industry and the Ministry of Public Security as one of the designated manufacturers for the national second-generation resident identity card specialized modules, it also undertakes packaging tasks for various industry modules, including financial dual-interface modules, social security, and telecommunications SIM modules.
The capacity for modular encapsulation technology
Product Types
Contact Modules, Non-Contact Modules, Dual-Interface Modules
Module Packaging Types
UV Adhesive, UV Dam Filling, Black Adhesive, Injection Molding
Non-Contact Module Encapsulation Specifications
240µm, 260µm, 300µm, 330µm, 385µm, 400µm
IC FRAME Specifications
M3 6-Pin, M28 Pin, Dual-Interface, Non-Contact
